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References

External links
Official website of the Department of Archaeology of the Ministry of Culture of Spain

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Category:Spanish male singersIt is common in many applications to make assemblies which include a leadless chip carrier and a ball grid array package. Typically, the leadless chip carrier will include a ball grid array array of balls or solder dots. It is also common to solder a leaded package to the ball grid array of the leadless chip carrier, so that the package and the chip carrier are soldered together.
The assembly process typically involves at least some of the following steps:
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This process has a number of drawbacks. For example, with the leadless chip carrier placed on the surface, and the leaded chip carrier placed on the ball grid array of the leadless chip carrier, there is no way to ensure that the leaded chip carrier is properly aligned on the ball grid array. Accordingly, if the leaded chip carrier is not properly aligned on the ball grid array, electrical connection between the leaded chip carrier and the leadless chip carrier will be defective.
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