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The assembly process typically involves at least some of the following steps:
1. placing the leadless chip carrier on a surface;
2. placing a leaded chip carrier on the ball grid array of the leadless chip carrier;
3. heating the leadless and leaded chip carriers so that the solder on the ball grid array melts, resulting in the formation of a conductive joint between the leaded chip carrier and the leadless chip carrier;
4. placing a molding compound on the leadless chip carrier to protect the chip carrier and the ball grid array of the leadless chip carrier; and
5. placing a heat sink on the leaded chip carrier.
This process has a number of drawbacks. For example, with the leadless chip carrier placed on the surface, and the leaded chip carrier placed on the ball grid array of the leadless chip carrier, there is no way to ensure that the leaded chip carrier is properly aligned on the ball grid array. Accordingly, if the leaded chip carrier is not properly aligned on the ball grid array, electrical connection between the leaded chip carrier and the leadless chip carrier will be defective.
Also, if an interconnect with too much length between a leaded package and a leadless chip carrier is used to permit proper alignment of the leaded chip carrier on the ball grid array of the leadless chip carrier, the interconnect may easily break during handling and placement of the leaded chip carrier on the ball grid array.This is possibly the best Halloween costume a kid has ever had. We don’t know if it’s inspiring bad parenting or if parents are just incredibly intuitive, but it doesn’t seem like a kid could sit in a room with all of their friends and not want
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